E-Catalog > Rugged Fanless Embedded > EMS-TGL

Key Features

• 11th Gen Intel® Core™ i7/i5/i3 BGA Processor
•  2 x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/s
• Rich I/O, 4-USB3.1, 1-DP, 1-HDMI, 2-COM, 2-LAN, 1-8bit GPIO.
• Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G Base-Tx GbE

• Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 70°C (ST)
• Wide range DC power input from +9~36V

• Support IET modules

• CE, FCC Class B, IP50

• Support HW TPM 2.0

Specifications

• CPU: 11th Gen Intel® Core™ i7/i5/i3 BGA Processor
• Memory: 2 x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/s
• Storage Device:

• 1 x M.2 Key-M 2242/2280, support PCIe Gen. III x 4 (NVMe SSD)
• 1 x M.2 Key-B 2242, support SATA (share with expansion slot)

• I/O Port (Front):

• 1xPower Button
• 1xReset Button
• 1xExt. Power Button
• 1xGPIO 8bit
• 2x RS232/422/485
• 3xLED
• 2xAntenna Holes (additional 4xAntenna Holes at side)

• I/O Port (Rear):

• 1xDP
• 1xHDMI
• 2xUSB3.1 Gen.1
• 2xUSB3.1 Gen.2
• 1x1Gb LAN
• 1x2.5Gb LAN
• 1 x Mic-In
• 1 x Line-Out
• 1x 3pin DC in
• 2xAntenna Holes

• Expansion

• 1 x M.2 2230 (Key-E), 1 x M.2 2242/3042/3052 (Key-B),
• 1 x IET interface (1 x DDI, 2x PCIe3 x 2, 3 x USB2.0,
• 1 x Line-Out(R/L), 1 x SMBus, LPC)

• Operating Temp. : -40 ~ 70°C

• Dimension (W x L xH) : 

• 240mm x 150mm x 48 mm (Standard)
• 240mm x 150mm x 69 mm (w/ IET module)

• Software Support

• Win 10 64bit , Linux

• Certification: CE, FCC Class B

• IP Rating: IP50

• TPM 2.0

• Support IET Modules

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